高速线缆信号完整性仿真优化与参数影响探究
Signal Integrity Simulation Optimization and Parameter Effects in High-Speed Cables
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摘要: 针对高速线缆设计中面临的信号完整性挑战,研究电磁仿真技术的优化应用及其对关键传输参数的影响。通过建立三维电磁模型,重点分析导体表面粗糙度、镀层厚度、屏蔽材料、结构耦合强度及导体、绝缘层几何偏芯等多种材料和工艺因素对特性阻抗、差模插入损耗(SDD21)及差模到共模传输系数(SCD21)的作用机制。研究表明,导体表面粗糙度对SCD21劣化影响显著;强耦合结构可有效改善SDD21;导体或内衬层的水平方向偏芯会严重破坏信号平衡性。通过实例的仿真与实测,得出阻抗和SDD21的仿真误差均小于2.5%;SCD21的仿真和实测趋势一致但受工艺波动影响较大。因此,电磁仿真可指导高速线缆性能优化与工艺参数控制,并显著提高设计效率与产品可靠性。Abstract: To address signal integrity challenges in high-speed cable design, a systematic study on the optimized application of electromagnetic simulation technology and its impact on key transmission parameters was conducted. Precise three-dimensional electromagnetic models were established to analyze the effects of various material and process factors—including conductor surface roughness, coating thickness, shielding material, structural coupling strength, and geometric eccentricity of conductors/inner jackets—on characteristic impedance, insertion loss (SDD21), and differential-to-common mode loss (SCD21). Key findings were identified: Conductor surface roughness was found to significantly deteriorate SCD21; a strong-coupling structure effectively improved SDD21; horizontal eccentricity in conductors or inner jackets severely compromised signal balance. Through case-study simulations and measurements, simulation errors for both impedance and SDD21 were found to be below 2.5%, while SCD21 showed consistent trends between simulation and measurement, though with notable sensitivity to process variations. Electromagnetic simulations were demonstrated to efficiently guide performance optimization and process parameter control in high-speed cable design, significantly enhancing development efficiency and product reliability.
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