铜线亚表面对漆包线表面质量的影响

    Effect of Copper Wire Subsurface on Surface Quality of Enameled Wire

    • 摘要: 为研究铜线亚表面形貌和腐蚀深度对漆包线表面质量的影响,对不同批次Φ2.000 mm的铜线表面腐蚀状况与产生铜粉的形貌进行观察,并对制备Φ0.800 mm漆包线所产生的铜粉质量、粒子和针孔数量进行统计分析。结果表明,当铜线亚表面存在缺陷并进行漆包线生产时,每万米漆包线表面的粒子数量和针孔数量增多;在硝酸溶液中腐蚀相同时间下,铜线腐蚀深度与制备漆包线产生的铜粉质量呈正比,铜粉质量增多导致每万米漆包线表面的粒子数量和针孔数量上升。

       

      Abstract: In order to study effects of subsurface morphology and corrosion depth of copper wire on surface quality of enameled wire, the surface corrosion condition and the morphology of copper powder from different batches of Φ2.000 mm copper wires were observed. Copper powder quality, particle number and pinhole number produced during the preparation of Φ0.800 mm enameled wires were statistically analyzed. Results showed that when defects were present on subsurface of copper wire, the number of particles and pinholeson per 10,000 m increased during production of enameled wire. Under the same time of corrosion in nitric acid solution, the corrosion depth of copper wire was directly proportional to the mass of copper powder produced during the preparation of enameled wire, and the increase of copper powder led to the increase of the number of particles and pinholes per 10,000 m of enameled wire.

       

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