交联剂和炭黑添加量对半导电屏蔽料性能的影响

    Effects of Crosslinking Agents and Carbon Black Content on Semi-Conductive Shielding Material Performance

    • 摘要: 为探究交联剂和炭黑(carbon black,CB)添加量对半导电屏蔽料性能的影响,以乙烯-丙烯酸丁酯共聚物(ethylene-butyl acrylate,EBA)为基体、CB为填料、2,4-二叔丁基过氧化异丙苯(BIBP)为交联剂,采用熔融共混及交联工艺制备高压电缆半导电屏蔽料,研究了BIBP和CB添加量对半导电屏蔽料热延伸、体积电阻率、机械性能和流变性能的影响。结果表明,当EBA和CB添加的质量份数分别为70、30时,随着BIBP添加量的增加,半导电屏蔽料的热延伸伸长率与永久变形率降低,体积电阻率增大,抗拉强度逐步提高,断裂伸长率呈先增大后减小的趋势,熔体流动速率增大;当BIBP添加的质量份数为1.0时,材料综合性能最优。当EBA、BIBP添加的质量份数分别为70、1.0时,随着CB添加量的增加,半导电屏蔽料的体积电阻率逐渐降低;当CB添加的质量份数增至25时,达到其逾渗阈值,半导电屏蔽料体积电阻率急剧下降;当CB添加的质量份数为35时,半导电屏蔽料在25 ℃和90 ℃温度下的体积电阻率分别为4.3、16.2 Ω·cm,此时正温度系数(positive temperature coefficient,PTC)为0.82,抑制PTC效应的效果最好;随着CB添加量继续增加,半导电屏蔽料的拉伸强度变化不明显,而断裂伸长率逐渐降低。因此,EBA和BIBP添加的质量份数分别为70、1.0,CB添加的质量份数在20~35范围时,半导电屏蔽料的机械性能均满足国标要求。

       

      Abstract: To investigate effects of the cross-linking agent and carbon black (CB) content on characteristics of semi-conductive shielding materials for high-voltage cables, a blend was prepared by incorporating conductive CB as filler, ethylene-butyl acrylate (EBA) copolymer as matrix and BIBP as cross-linking agent via melt blending and crosslinking. Influences of BIBP and CB content on thermal elongation, volume resistivity, mechanical properties and rheological performance of semi-conductive shielding materials were studied. Results showed that when the addition amount of EBA and CB were 70 and 30, as BIBP content increased, thermal elongation and permanent deformation rate of the semi-conductive shielding material decreased, volume resistivity increased, tensile strength gradually improved, elongation at break showed a trend of initially increasing and then decreasing, and melt flow index increased. When the addition amount of BIBP was 1.0, overall performance was optimal. When the addition amount of EBA and BIBP were 70 and 1.0, as CB content increased, volume resistivity of the semi-conductive shielding material gradually decreased. When the addition amount of CB increased to 25, reaching its percolation threshold, volume resistivity of the semi-conductive shielding material dropped sharply. When the addition amount of CB was 35, volume resistivity of the semi-conductive shielding material was 4.3 Ω·cm and 16.2 Ω·cm at 25 ℃ and 90 ℃, respectively. Simultaneously, the positive temperature coefficient (PTC) was 0.82, indicating the best suppression effect on PTC. As the CB content increased, tensile strength remained relatively stable, while elongation at break gradually decreased. When the addition amounts of EBA and BIBP were 70 and 1.0 respectively, and CB content was in the range of 20-35, mechanical properties all met national standard requirements.

       

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