半导电带与绝缘带错用对整体预制式绝缘接头性能的影响
Influence of Misapplication of Semi-conductive Tape and Insulating Tape on The Performance of Monolithic Prefabricated Insulated Joint
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摘要: 针对高压电缆特定外屏结构的整体预制式绝缘接头,研究外屏绕包工序中半导电带错换为绝缘带对电气性能的影响。通过理论分析材料错用对界面电场分布的作用机理,结合有限元仿真模拟不同外屏材料下的电场特征,并设计模拟试验进行验证发现:材料错换后,在运行电压下接头外屏电场强度由0kV/mm升至1.1 kV/mm,界面切向电场畸变显著,局部放电量达102pC。该工艺偏差会严重劣化绝缘接头的电气性能,工程中需严格管控外屏绕包工序以防止材料错换。Abstract: For the overall prefabricated insulation joint of high-voltage cables with a specific outer shield structure, the influence of mistakenly using insulating tape instead of semiconductive tape in the outer shield winding process on the electrical performance was studied. Through theoretical analysis of the mechanism of the effect of material misapplication on the interface electric field distribution, combined with finite element simulation of the electric field characteristics under different outer shield materials, and the design of simulation experiments for verification, it was found that after the material was mistakenly replaced, the electric field intensity of the outer shield of the joint under operating voltage increased from 0kV/mm to 1.1kV/mm, the tangential electric field distortion at the interface was significant, and the partial discharge quantity reached 102pC. This process deviation will seriously deteriorate the electrical performance of the insulation joint, and strict control of the outer shield winding process is required in engineering to prevent material misapplication.
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